Source: FUNDAMENTALS OF MICROSYSTEMS PACKAGING C H A P T E 1. R INTRODUCTION TO MICROSYSTEMS PACKAGING Prof. Rao R. Tummala. “LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the fields leading author, Fundamentals of Microsystems. FUNDAMENTALS OF. MICROSYSTEMS PACKAGING. Rao R. Tummala. Georgia Institute of Technology. Editor. Angie Hughes. Nancy Trent. Mahesh.

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Learn more about Amazon Prime. Withoutabox Submit to Film Festivals. Professor Tummala’s latest book should appeal to only three groups: Microsystems packaging specialists, who typically microsysgems on one sub-specialty, will find this detailed exposition of the entire field broadening. In summary, despite my forty years in microelectronics research, engineering, management, and consulting, I learned new things every time I opened this book.

Similar Items Related Subjects: Search WorldCat Find items in libraries near you. Talented illustrators provided a wealth of informative two-color pictures, charts, pictures, and diagrams. Novices, students, and those in related technical fields will find a well-structured introduction that prepares them to deal with microsystems packaging.

Top Reviews Most recent Top Reviews. English View all editions and formats Rating: Miniature electronic equipment — Packaging — Handbooks, manuals, pf. Description A fully updated, comprehensive guide to electronic packaging technologies This thoroughly revised resource offers rigorous and complete coverage of microsystems packaging at both the device and system level.


Please choose whether or not you want other users to be able pavkaging see on your profile that this library is a favorite of yours. Please enter recipient e-mail address es. Off is the world’s largest library catalog, helping you find library materials online. Home About Help Search. New chapters cover topics highly relevant to today’s small and ultra-small systems.

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The book details emerging systems, including smart wearables, the Internet of Things, bioelectronics for medical applications, cloud computing, and much more. Create lists, bibliographies and reviews: Amazon Renewed Refurbished products with a warranty. Amazon Restaurants Food delivery from local restaurants. Linked Data More info about Linked Data. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the entire field, he is an electronics and materials engineer and an experienced designer of microelectronics.

Fundamentals of Microsystems Packaging

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Reviews User-contributed reviews Add a review and share your thoughts with other readers. The E-mail Address es field is required. Subjects Electronic packaging — Handbooks, manuals, etc. AmazonGlobal Od Orders Internationally.

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User lists Similar Items. Citations are based on reference standards. Introduction to microsystems packaging — Role of packaging in microelectroncis — Role of packaging in microsystems — Fundamentals of electrical package design — Fundamentals packagijg design for reliability — Fundamentals of thermal management — Fundamentals of single chip packaging — Fundamentals of multichip packaging — Fundamentals of IC assembly — Fundamentals of wafer-level packaging — Fundamentals of passives: Available soon, pre-order now.

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